Polyimide aerogel
Thermal insulation with high-performance polyimide aerogel for demanding applications
Highlights
Dust-free and robust – Ideal for clean environments
Thinnest layers – Perfect for space-constrained applications
Outstanding Thermal Insulation – for maximum energy efficiency
High Temperature Resistance – for demanding environments
Excellent RF and Dielectric Properties – ultra-low dielectric constant and dielectric loss
Ultra-Thin Polyimide Aerogel Film PIF
PI Aerogel Film PIF is an advanced lightweight insulation material based on a three-dimensional cross-linked mesoporous polyimide aerogel structure. It combines the outstanding thermal stability and chemical resistance of polyimide with the ultra-low density and excellent thermal insulation properties of aerogels.
PI Aerogel Film PIF offers extremely low dielectric constant (Dk) and dielectric loss (Df). It is especially suitable for high-frequency electronics, RF applications, advanced battery systems, aerospace components, and ultra-thin thermal barrier solutions.
PI Aerogel Film PIF consists of a dust-free and flexible film structure which enables easy integration into demanding applications where space, weight, thermal management, and dielectric performance are critical.
Highlights
Outstanding Thermal Insulation
Very low thermal conductivity of only 0.020 – 0.025 W/(m·K) enables highly efficient insulation in minimal space.
Ultra-Thin and Space Saving
Available in thicknesses from 0.1 – 0.3 mm, making it ideal for compact electronics and next-generation device architectures.
Excellent RF and Dielectric Properties
Ultra-low dielectric constant and dielectric loss support high-frequency signal transmission and RF insulation applications.
Lightweight Material
Low density of 100 – 150 kg/m³ contributes to reduced component weight and improved system efficiency.
High Temperature Resistance
Maximum operating temperature up to 150°C
Thermal decomposition temperature above 550°C
Non-Flammable
Excellent fire resistance characteristics for safety-critical applications.
Robust and Easy to Integrate
Dust-free handling and good mechanical integrity simplify processing and integration into advanced systems.
Water and Humidity Resistant
Suitable for challenging environmental conditions and long-term durability.
Typical Applications
High-frequency electronics and RF modules
Battery thermal management
Consumer electronics
Aerospace and aviation systems
Semiconductor and chip packaging
Flexible electronics
Thermal barriers in confined spaces
Lightweight insulation systems
Why PI Aerogel Film PIF?
PI Aerogel Film PIF enables a unique combination of:
Ultra-thin insulation
Excellent thermal resistance
RF transparency
Low dielectric loss
Lightweight design
High temperature stability
This makes it an ideal next-generation material for modern electronic and thermal management systems where conventional insulation materials reach their limits.
Typical Properties
Thermal conductivity: 0.020 – 0.025 W/(m*K)
Thickness: 0.1 – 0.3 mm (variable)
Format: up to 200 x 200 mm
Density: 100-150 g/l
Specific surface area: >315 m²/g
Maximum operating temperature: 150°C
Thermal decomposition temperature: 550°C
Non-flammable
Dielectric constant (Dk) 102 to 106 Hz: 1.38 – 1.50
Dielectric loss (Df) 102 to 106 Hz: 0.001 – 0.005
Dielectric constant (Dk) 10 GHz: 1.18 – 1.30
Dielectric loss (Df) 10 GHz: 0.0006 – 0.0015
WeCircleValley