Polyimide aerogel

Thermal insulation with high-performance polyimide aerogel for demanding applications

Highlights

Dust-free and robust – Ideal for clean environments

Thinnest layers – Perfect for space-constrained applications

Outstanding Thermal Insulation – for maximum energy efficiency

High Temperature Resistance – for demanding environments

Excellent RF and Dielectric Properties – ultra-low dielectric constant and dielectric loss

Ultra-Thin Polyimide Aerogel Film PIF

PI Aerogel Film PIF is an advanced lightweight insulation material based on a three-dimensional cross-linked mesoporous polyimide aerogel structure. It combines the outstanding thermal stability and chemical resistance of polyimide with the ultra-low density and excellent thermal insulation properties of aerogels.

PI Aerogel Film PIF offers extremely low dielectric constant (Dk) and dielectric loss (Df). It is especially suitable for high-frequency electronics, RF applications, advanced battery systems, aerospace components, and ultra-thin thermal barrier solutions.

PI Aerogel Film PIF consists of a dust-free and flexible film structure which enables easy integration into demanding applications where space, weight, thermal management, and dielectric performance are critical.

Highlights

Outstanding Thermal Insulation

Very low thermal conductivity of only 0.020 – 0.025 W/(m·K) enables highly efficient insulation in minimal space.

Ultra-Thin and Space Saving

Available in thicknesses from 0.1 – 0.3 mm, making it ideal for compact electronics and next-generation device architectures.

Excellent RF and Dielectric Properties

Ultra-low dielectric constant and dielectric loss support high-frequency signal transmission and RF insulation applications.

Lightweight Material

Low density of 100 – 150 kg/m³ contributes to reduced component weight and improved system efficiency.

High Temperature Resistance

Maximum operating temperature up to 150°C

Thermal decomposition temperature above 550°C

Non-Flammable

Excellent fire resistance characteristics for safety-critical applications.

Robust and Easy to Integrate

Dust-free handling and good mechanical integrity simplify processing and integration into advanced systems.

Water and Humidity Resistant

Suitable for challenging environmental conditions and long-term durability.

Typical Applications

High-frequency electronics and RF modules

Battery thermal management

Consumer electronics

Aerospace and aviation systems

Semiconductor and chip packaging

Flexible electronics

Thermal barriers in confined spaces

Lightweight insulation systems

Why PI Aerogel Film PIF?

PI Aerogel Film PIF enables a unique combination of:

Ultra-thin insulation

Excellent thermal resistance

RF transparency

Low dielectric loss

Lightweight design

High temperature stability

This makes it an ideal next-generation material for modern electronic and thermal management systems where conventional insulation materials reach their limits.

Typical Properties

Thermal conductivity: 0.020 – 0.025 W/(m*K)

Thickness: 0.1 – 0.3 mm (variable)

Format: up to 200 x 200 mm

Density: 100-150 g/l

Specific surface area: >315 m²/g

Maximum operating temperature: 150°C

Thermal decomposition temperature: 550°C

Non-flammable

Dielectric constant (Dk) 10² to 10⁶ Hz: 1.38 – 1.50

Dielectric loss (Df) 10² to 10⁶ Hz: 0.001 – 0.005

Dielectric constant (Dk) 10 GHz: 1.18 – 1.30

Dielectric loss (Df) 10 GHz: 0.0006 – 0.0015

By leveraging advanced polyimide aerogel technology, aerogel-it is redefining thermal insulation standards, delivering unmatched performance in compact and challenging environments.

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