New aerogel material at aerogel-it: ultrathin Polyimide Aerogel Film PIF

aerogel-it is expanding its aerogel material portfolio with a new product: ultrathin Polyimide Aerogel Film PIF.

This new material development combines two highly attractive material worlds: the temperature stability and robustness of polyimide with the low density and excellent thermal insulation performance of aerogel materials. The result is an advanced, lightweight aerogel film designed for applications where every millimetre matters.

Polyimide Aerogel Film PIF is currently available in very thin film thicknesses in the range of 0.1–0.3 mm. At the same time, the material offers a thermal conductivity of 0.020–0.025 W/(m·K) at 25°C, making it a promising candidate for compact thermal insulation concepts in demanding technical environments.

Why polyimide aerogel?

Polyimide is known for its robustness, temperature stability and chemical resistance. Aerogels, on the other hand, are valued for their low density and outstanding thermal insulation performance. Polyimide Aerogel Film PIF brings these properties together in a three-dimensional, cross-linked, mesoporous polymer network made of polyimide.

This combination opens up interesting possibilities for applications where conventional insulation materials are too thick, too heavy or not suitable for the technical environment.

Ultra-thin insulation for space-limited applications

In many modern applications, thermal management is becoming increasingly complex. Electronic devices are becoming smaller, systems are becoming more powerful, and available installation space is often extremely limited.

This is exactly where ultra-thin Polyimide Aerogel Film PIF can offer an interesting solution. With thicknesses currently in the range of 0.1–0.3 mm, the material is designed for ultra-thin thermal insulation layers that can be integrated into compact designs.

Potential use cases include:

• Compact electronics
• High-frequency and RF systems
• Thermal barriers in confined spaces
• Technical insulation layers for demanding environments
• Applications where low weight and low thickness are critical

Thermal insulation performance

One of the key characteristics of Polyimide Aerogel Film PIF is its low thermal conductivity. According to the current technical datasheet, the material reaches a thermal conductivity of 0.020–0.025 W/(m·K) at 25°C.

This makes the material suitable for development projects where very thin insulation layers are required, but thermal performance remains important. In addition, the low density of the material supports lightweight design concepts.

Designed for demanding technical environments

Polyimide Aerogel Film PIF is being developed for applications that require more than only low thermal conductivity. The material also offers a combination of properties that can be relevant for demanding industrial and electronic applications.

Key material features include:

• Ultra-thin thermal insulation layers
• Low thermal conductivity
• Low density
• Low dielectric constant and dielectric loss
• Low-loss insulation for high-frequency electronics
• Thermal barriers for demanding environments
• Dust-free handling
• Easy integration
• Temperature resistance
• Fire resistance
• Water and humidity resistance
• Long-term robustness

The material also shows dielectric stability across a wide frequency range, making it particularly interesting for electronic and RF-related applications where thermal insulation and dielectric properties both play an important role.

A material for development partnerships

Polyimide Aerogel Film PIF is currently still in the R&D phase. This means that we are actively working on the further development of the material and are exploring suitable application areas together with partners, engineers and product developers.

We are especially interested in exchanging ideas with companies and development teams working on:

• Compact electronic devices
• RF and high-frequency systems
• Advanced thermal management
• Thin thermal barrier solutions
• Lightweight insulation concepts
• Next-generation technical insulation materials

At this stage, early application discussions are particularly valuable. They help us understand specific technical requirements and evaluate how Polyimide Aerogel Film PIF can be adapted or further developed for real-world use cases.

Let’s discuss your application

With Polyimide Aerogel Film PIF, aerogel-it is taking another step toward advanced aerogel-based solutions for technical applications.

If you are working on compact electronics, RF systems, thermal barriers or next-generation insulation challenges, we would be happy to exchange ideas with you.

Get in touch with us to discuss potential applications and development opportunities.