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𝐒𝐢𝐱 𝐲𝐞𝐚𝐫𝐬 𝐨𝐟 𝐜𝐨𝐥𝐥𝐚𝐛𝐨𝐫𝐚𝐭𝐢𝐨𝐧: 𝐚𝐞𝐫𝐨𝐠𝐞𝐥-𝐢𝐭 𝐚𝐧𝐝 𝐄𝐱𝐮𝐮𝐝 𝐚𝐫𝐞 𝐭𝐚𝐤𝐢𝐧𝐠 𝐛𝐢𝐨𝐚𝐞𝐫𝐨𝐠𝐞𝐥𝐬 𝐢𝐧𝐭𝐨 𝐟𝐫𝐚𝐠𝐫𝐚𝐧𝐜𝐞 𝐚𝐧𝐝 𝐛𝐞𝐚𝐮𝐭𝐲.

𝐖𝐡𝐚𝐭 𝐢𝐟 𝐟𝐫𝐚𝐠𝐫𝐚𝐧𝐜𝐞 𝐜𝐨𝐮𝐥𝐝 𝐛𝐞 𝐬𝐭𝐨𝐫𝐞𝐝 𝐢𝐧 𝐚𝐢𝐫?

Since 2020, 𝐚𝐞𝐫𝐨𝐠𝐞𝐥-𝐢𝐭 and 𝐄𝐱𝐮𝐮𝐝 𝐈𝐧𝐜. have been working together on a shared ambition: to explore how bioaerogels can enable entirely new applications in fragrance and beauty.

It is a collaboration built on very different, but highly complementary expertise:

▶️ Exuud brings its vision for fragrance, formulation expertise, product development and access to the beauty market.

▶️ aerogel-it contributes the bioaerogel materials, process technology and know-how required to translate new materials from the laboratory towards scalable production.

Over six years of joint development, first ideas and material samples have evolved into 𝐒𝐨𝐥𝐢𝐪𝐚𝐢𝐫𝐞™, a new application platform based on highly porous, bio-based carrier materials.

For us as aerogel-it, this collaboration demonstrates something important about aerogels: their potential extends far beyond thermal insulation. Their unique pore structures can turn them into functional materials for storing and releasing liquids and active components – opening opportunities in entirely different industries.

But above all, this is a story about what can happen when two teams combine complementary technologies, remain curious and keep developing an idea together over many years.

We are proud of what we as aerogel-it have built with Exuud since 2020 – and of the next chapter that is now taking shape.

Our thanks go to Abhishek K Breja, Jesse Killion and the entire Exuud team for the collaboration, patience and trust.

𝐁𝐮𝐢𝐥𝐭 𝐭𝐨𝐠𝐞𝐭𝐡𝐞𝐫. 𝐁𝐮𝐢𝐥𝐭 𝐭𝐨 𝐬𝐜𝐚𝐥𝐞.

Exuud x aerogel-it

Aerogel coatings

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Ask Dr. Marc with Markus Blazaizak

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New aerogel material at aerogel-it: ultrathin Polyimide Aerogel Film PIF

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aerogel-it is expanding its aerogel material portfolio with a new product: ultrathin Polyimide Aerogel Film PIF.

This new material development combines two highly attractive material worlds: the temperature stability and robustness of polyimide with the low density and excellent thermal insulation performance of aerogel materials. The result is an advanced, lightweight aerogel film designed for applications where every millimetre matters.

Polyimide Aerogel Film PIF is currently available in very thin film thicknesses in the range of 0.1–0.3 mm. At the same time, the material offers a thermal conductivity of 0.020–0.025 W/(m·K) at 25°C, making it a promising candidate for compact thermal insulation concepts in demanding technical environments.

Why polyimide aerogel?

Polyimide is known for its robustness, temperature stability and chemical resistance. Aerogels, on the other hand, are valued for their low density and outstanding thermal insulation performance. Polyimide Aerogel Film PIF brings these properties together in a three-dimensional, cross-linked, mesoporous polymer network made of polyimide.

This combination opens up interesting possibilities for applications where conventional insulation materials are too thick, too heavy or not suitable for the technical environment.

Ultra-thin insulation for space-limited applications

In many modern applications, thermal management is becoming increasingly complex. Electronic devices are becoming smaller, systems are becoming more powerful, and available installation space is often extremely limited.

This is exactly where ultra-thin Polyimide Aerogel Film PIF can offer an interesting solution. With thicknesses currently in the range of 0.1–0.3 mm, the material is designed for ultra-thin thermal insulation layers that can be integrated into compact designs.

Potential use cases include:

  • Compact electronics
  • High-frequency and RF systems
  • Thermal barriers in confined spaces
  • Technical insulation layers for demanding environments
  • Applications where low weight and low thickness are critical

Thermal insulation performance

One of the key characteristics of Polyimide Aerogel Film PIF is its low thermal conductivity. According to the current technical datasheet, the material reaches a thermal conductivity of 0.020–0.025 W/(m·K) at 25°C.

This makes the material suitable for development projects where very thin insulation layers are required, but thermal performance remains important. In addition, the low density of the material supports lightweight design concepts.

Designed for demanding technical environments

Polyimide Aerogel Film PIF is being developed for applications that require more than only low thermal conductivity. The material also offers a combination of properties that can be relevant for demanding industrial and electronic applications.

Key material features include:

  • Ultra-thin thermal insulation layers
  • Low thermal conductivity
  • Low density
  • Low dielectric constant and dielectric loss
  • Low-loss insulation for high-frequency electronics
  • Thermal barriers for demanding environments
  • Dust-free handling
  • Easy integration
  • Temperature resistance
  • Fire resistance
  • Water and humidity resistance
  • Long-term robustness

The material also shows dielectric stability across a wide frequency range, making it particularly interesting for electronic and RF-related applications where thermal insulation and dielectric properties both play an important role.

A material for development partnerships

Polyimide Aerogel Film PIF is currently still in the R&D phase. This means that we are actively working on the further development of the material and are exploring suitable application areas together with partners, engineers and product developers.

We are especially interested in exchanging ideas with companies and development teams working on:

  • Compact electronic devices
  • RF and high-frequency systems
  • Advanced thermal management
  • Thin thermal barrier solutions
  • Lightweight insulation concepts
  • Next-generation technical insulation materials

At this stage, early application discussions are particularly valuable. They help us understand specific technical requirements and evaluate how Polyimide Aerogel Film PIF can be adapted or further developed for real-world use cases.

Let’s discuss your application

With Polyimide Aerogel Film PIF, aerogel-it is taking another step toward advanced aerogel-based solutions for technical applications.

If you are working on compact electronics, RF systems, thermal barriers or next-generation insulation challenges, we would be happy to exchange ideas with you.

Get in touch with us to discuss potential applications and development opportunities.

Polyimide aerogel film PIF
Our new ultrathin Polyimide Aerogel Film PIF

Polyimide aerogel

Polyimide aerogel

Thermal insulation with high-performance polyimide aerogel for demanding applications

Highlights

Dust-free and robust – Ideal for clean environments

Thinnest layers – Perfect for space-constrained applications

Outstanding Thermal Insulation – for maximum energy efficiency

High Temperature Resistance – for demanding environments

Excellent RF and Dielectric Properties – ultra-low dielectric constant and dielectric loss

Ultra-Thin Polyimide Aerogel Film PIF

Polyimide aerogel film PIF

PI Aerogel Film PIF is an advanced lightweight insulation material based on a three-dimensional cross-linked mesoporous polyimide aerogel structure. It combines the outstanding thermal stability and chemical resistance of polyimide with the ultra-low density and excellent thermal insulation properties of aerogels.

PI Aerogel Film PIF offers extremely low dielectric constant (Dk) and dielectric loss (Df). It is especially suitable for high-frequency electronics, RF applications, advanced battery systems, aerospace components, and ultra-thin thermal barrier solutions.

PI Aerogel Film PIF consists of a dust-free and flexible film structure which enables easy integration into demanding applications where space, weight, thermal management, and dielectric performance are critical.

Highlights

Outstanding Thermal Insulation

Very low thermal conductivity of only 0.020 – 0.025 W/(m·K) enables highly efficient insulation in minimal space.

Ultra-Thin and Space Saving

Available in thicknesses from 0.1 – 0.3 mm, making it ideal for compact electronics and next-generation device architectures.

Excellent RF and Dielectric Properties

Ultra-low dielectric constant and dielectric loss support high-frequency signal transmission and RF insulation applications.

Lightweight Material

Low density of 100 – 150 kg/m³ contributes to reduced component weight and improved system efficiency.

High Temperature Resistance

Maximum operating temperature up to 150°C

Thermal decomposition temperature above 550°C

Non-Flammable

Excellent fire resistance characteristics for safety-critical applications.

Robust and Easy to Integrate

Dust-free handling and good mechanical integrity simplify processing and integration into advanced systems.

Water and Humidity Resistant

Suitable for challenging environmental conditions and long-term durability.

Typical Applications

High-frequency electronics and RF modules

Battery thermal management

Consumer electronics

Aerospace and aviation systems

Semiconductor and chip packaging

Flexible electronics

Thermal barriers in confined spaces

Lightweight insulation systems

Why PI Aerogel Film PIF?

PI Aerogel Film PIF enables a unique combination of:

Ultra-thin insulation

Excellent thermal resistance

RF transparency

Low dielectric loss

Lightweight design

High temperature stability

This makes it an ideal next-generation material for modern electronic and thermal management systems where conventional insulation materials reach their limits.

Typical Properties

Thermal conductivity: 0.020 – 0.025 W/(m*K)

Thickness: 0.1 – 0.3 mm (variable)

Format: up to 200 x 200 mm

Density: 100-150 g/l

Specific surface area: >315 m²/g

Maximum operating temperature: 150°C

Thermal decomposition temperature: 550°C

Non-flammable

Dielectric constant (Dk) 102 to 106 Hz: 1.38 – 1.50

Dielectric loss (Df) 102 to 106 Hz: 0.001 – 0.005

Dielectric constant (Dk) 10 GHz: 1.18 – 1.30

Dielectric loss (Df) 10 GHz: 0.0006 – 0.0015

By leveraging advanced polyimide aerogel technology, aerogel-it is redefining thermal insulation standards, delivering unmatched performance in compact and challenging environments.

For more answers, please contact us.

WEcircleValley Kickoff Conference in Osnabrück

This week, we had the pleasure of participating in the WEcircleValley Kickoff Conference in Osnabrück. It was an inspiring event dedicated to accelerating innovation in circular economy, sustainable materials, and bio-based industrial solutions.

During the conference, our Sales Director Eduard presented the latest developments in our next-generation aerogel technologies, including biomineral silica aerogels and cellulose-based aerogels. These advanced materials demonstrate how high-performance insulation solutions can support the transition toward a more sustainable, resource-efficient, and circular economy.

Aerogels are known for their exceptional thermal insulation performance, lightweight structure, and versatility across industrial applications. By integrating renewable and bio-based raw materials into aerogel production, we aim to reduce environmental impact while maintaining the outstanding material properties required for modern energy-efficient applications.

One of the central themes throughout the conference was the transformation of side streams and renewable resources into valuable products and industrial applications. The discussions clearly showed that future sustainable industries will depend not only on technological innovation, but also on strong cooperation between businesses, research institutions, agriculture, policymakers, and public stakeholders.

We were particularly inspired by the conference’s strong emphasis on practical implementation and scalable solutions. From sustainable material development to energy efficiency and resource utilization, the event highlighted many promising approaches that can help accelerate the transition toward climate-friendly and circular industrial systems.

Events like this one hosted by WEcircleValley play an important role in connecting innovators across the entire value chain and creating opportunities for collaboration, knowledge exchange, and future partnerships.

We would like to sincerely thank WEcircleValley, the organizers, project partners, speakers, and all participants for creating such an open and forward-looking platform for innovation and collaboration. We look forward to continuing these discussions and contributing to the development of sustainable material technologies for the future.

Eduard Siemens presenting at WeCircleValley KickOff conference
Eduard Siemens presenting at WeCircleValley KickOff conference
Eduard Siemens discussing at WeCircleValley KickOff conference
Eduard Siemens discussing at WeCircleValley KickOff conference

First strategy team meeting Q1 2026

What happens when two outstanding minds join a team that is already moving at full speed?

At the start of 2026, we got to find out.

In January, we were very happy to welcome Finn and Erik to our R&D team. Since then, they’ve been doing fantastic work alongside Alberto—pushing our already high R&D velocity to new and unexpected levels, and delivering important results for our next-generation aerogel materials such as the biomineral silica aerogel and the cellulose bioaerogel as well as our process technology.

Of course, growth also brings complexity. Keeping everyone aligned and connected becomes more important than ever. That’s why we introduced quarterly in-person strategy team meetings (with dinner included) to stay in sync.

This week marked our first session at the end of Q1. Marc and Dirk shared updates on company strategy and direction, while the team contributed plenty of new ideas and fine-tuned ongoing workstreams. The verdict: a clear success—and definitely something we will continue.

We wrapped up the day with an excellent dinner at 60s to Napoli downstairs—before catching the train back to Osnabrück (almost on time, which felt like a bonus).

A big thank you to Dr. Lutz Drallé and the team at LUPP + PARTNER for hosting us in their Hamburg office and taking such great care of us.

Team dinner at 60s to Napoli HH Q1 2026
Team dinner at 60s to Napoli HH Q1 2026
Strategy meeting Q1 2026 in HH
Strategy meeting Q1 2026 in HH
Finn and Alberto at 60s to Napoli
Finn and Alberto at 60s to Napoli

Talk on Aerogel Materials at Hochschule Osnabrück

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Recently, Dirk had the opportunity to give a talk on aerogel materials at Hochschule Osnabrück. This talk was part of the lecture series “Materials in Future Technologies” by Prof. Dr. Markus Susoff and Prof. Dr. Svea Petersen. 👩‍🎓👨‍🎓

It doesn’t happen often that the team can step out of the day-to-day work to talk about what we do. And it was a real pleasure for Dirk to take this time to share with a group of master students what makes aerogels such a fascinating class of materials.

The focus of this session which also included polymer foams and other materials was energy efficiency. This is a field that aerogels as excellent thermal insulators feel right at home in. From heat shields for electric vehicle batteries to energy-efficient building renovation, aerogels are already enabling real-world solutions. But beyond that there is much more – including completely new applications and aerogel materials such as biomineral silica aerogels and bioaerogels that we as aerogel-it are working on.

What stood out most, though, was the reminder of how fortunate we as aerogel-it are: working every day on such an advanced technology we truly believe in. And pushing the boundaries every day with the great team that we as a company have grown into. Our passion for aerogels has kept us going for more than a decade. And there is still so much to explore and value to create.

Looking forward to what the next decades will bring!

Dirk and master students at Hochschule Osnabrück
Dirk and master students at Hochschule Osnabrück
Prof. Dr. Markus Susoff and master students at Hochschule Osnabrück
Prof. Dr. Markus Susoff and master students at Hochschule Osnabrück